The Development of a 0.3mm Pitch CSP Assembly Process Part 2: Assembly & ReliabilityAuthors: Mark Whitmore and Jeff Schake
Company: ASM Assembly Systems
Date Published: 4/12/2016 Conference: Symposium
A major study has been undertaken looking at several different aspects of the stencil printing process and their impact upon the assembly and reliability of 0.3mm pitch CSP components.
Previously, in Part 1, stencil printing factors such as aperture design (circles, rotated squares), aperture size (140 microns thru 200 microns) and printing technology (standard squeegees, active squeegees) were investigated. Highlights of the experiments are summarised here (whilst full details can be found in the 2015 conference proceedings of SMTA South East Asia  and SMTA ICSR ).
Key learnings from Part 1 have subsequently been used for a series of assembly trials to determine the impact, (if any) of the stencil printing process on ultimate solder joint reliability of 0.3 mm pitch CSP assemblies. Assembly yields in terms of electrical continuity and identification of shorted solder bumps are reported here, together with preliminary reliability data from ongoing thermal cycling of assemblies.
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