High reliability Interconnects for High Power LED Assembly
Authors: Ravi M. Bhatkal, Ph.D., Amit Patel and Ranjit Pandher, Ph.D. Company: Alpha Assembly Solutions Date Published: 4/12/2016
Abstract: New high and ultra-high power LED package designs provide high lumen density that can enable significant system cost reductions through fewer LEDs, smaller PCBs, and smaller heat sink size requirements. Use of high and ultra-high power packages necessitates use of Metal Core PCBs for thermal management. However, such a materials stack, combined with high operating temperature inherent in such systems, results in significant CTE mismatch between the high power LED ceramic submount and the Metal Core PCB, which places significant performance demands on the solder joints. One of the key questions is: What role does the solder alloy play in the LED package-on-board assembly reliability? This paper presents a study to help answer this question.