Surface Mount International Conference Proceedings


Author: S. Wege
Company: Technical University of Munich
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: Recent innovations in the manufacture of electronic assemblies have increased thermal and mechanical requirements on solder joints which standard tin-lead solder alloys can no longer meet. Therefore other solder alloys are necessary. In this work the solder alloys SnAg3.5, SnCu 1 ~andSnBi9.5Cu0.5 were investigated in comparison to Sn63pb. Test specimens with different components and different substrate mettallizmions were produced using a wave and a reflow soldering process. For the reliability tests, soldered test boards were loaded by thermal cycling. The influence of the substrate metallization and solder on the damage of the solder joints were examined and compared.

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