Symposium Conference Proceedings


Led Die Attach-Trends & Considerations

Authors: Gyan Dutt and Ravi Bhatkal
Company: Alpha Assembly Solutions
Date Published: 4/12/2016   Conference: Symposium


Abstract: Die attach material plays a key role in performance and reliability of mid, high and super-high power LEDs. The selection of the suitable die-attach material for a particular chip structure and application depends on several considerations. These include packaging process (throughput and yield), performance (thermal dissipation and light output), reliability (lumen maintenance) and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones and sintered materials have all been used for LED die-attach. Often, use of a particular technology platform results in trade-off between different attributes.



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