Symposium Conference Proceedings

Novel Lead-Free Solder Alloys Development for Automotive Applications

Authors: Weiping Liu, Ph.D. and Ning-Cheng Lee, Ph.D.
Company: Indium Corporation
Date Published: 4/12/2016   Conference: Symposium

Abstract: For high power device applications, where silicon die is mounted onto leadframe with solder preform, six lead-free solder alloys were evaluated for reliability against 92Pb5.25Sn2.75Ag. The solder joints were pre-conditioned with Thermal Shock treatment, then followed by shear strength test, or cross-sectional analysis, or C-SAM and X-Ray analysis. The shear strength test and cross-sectional analysis data are consistent, with results indicating that the top four alloys are SAC+SbBi alloys, followed by SAC+SbNi. SAC+SbBiNiCo and high-Pb alloy are poorer, with solder paste joint being the poorest, attributable to the high voiding within joints. C-SAM data showed different reliability data trend, probably due to misleading signal caused by cracked joints with solder remaining in contact. X-ray voiding data also showed poor correlation with shear strength and crack.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819