The Use of Complex Alloys to Achieve High Reliability Lead Free Solder JointsAuthors: Neil Poole, Ph.D.
Company: Henkel Electronic Materials LLC
Date Published: 4/12/2016 Conference: Symposium
The resulting complex alloy displays enhanced thermal cycle resistance when compared with both Sn/Pb and SAC alloys, across all conditions so far tested. In addition to the improved thermal cycle performance the alloy has demonstrated higher operating temperatures and good vibration resistance, making this alloy a good candidate for severe environments such as automotive under hood
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