A Discrete Foundation Model to Predict Load Sharing in Pairs of Solder Joints
Authors: Saeed Akbari, Amir Nourani, Jan K. Spelt Company: University of Toronto Date Published: 5/9/2016
ICSR (Soldering and Reliability)
Abstract: Load sharing between multiple solder joints is a function of geometric parameters such as solder joint length, spacing and substrate thickness, and material properties such as Young's modulus. A discrete foundation model was developed to understand the relative roles of these factors in load sharing among solder joints. Each joint was modeled using one or two springs elements, where the stiffness reflects contributions from the solder and the connected substrates. Comparison with experimental data showed that the model could successfully predict the optimal joint spacing in a double cantilever beam copper-solder-copper specimen with two discrete joints. The proposed model was then used to find the critical joint spacing in resistor joints under circuit board bending.
solder joints, load sharing, spacing, discrete foundation model