How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case StudyAuthors: Brook Sandy-Smith
Company: Indium Corporation
Date Published: 5/9/2016 Conference: ICSR (Soldering and Reliability)
This study will review several cases where changing the stencil design or reflow profile dialed in the variation of comparative results. The same typical, commercially available test vehicle was used with the provided stencil as well as with modified designs. Due to the nature of the comparison testing, we observed the effects with both high-voiding and low-voiding pastes. In cases where the stencil design balanced the inclusion of venting channels and the optimal solder volume, the lowest variation (and best comparison) was achieved.
QFN Voiding, Reduced Voiding, Reflow Profile, Stencil Design
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.