Why Clean A No-Clean FluxAuthors: Mike Bixenman, DBA, Mark McMeen, Bruno Tolla, Ph.D.
Company: Kyzen Corporation, STI Corporation, and Kester Corporation
Date Published: 5/9/2016 Conference: ICSR (Soldering and Reliability)
As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Why Clean A No-Clean Flux
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