Progress and Application of Through Glass Via (TGV) TechnologyAuthors: Aric B. Shorey and Rachel Lu
Company: Corning, Incorporated
Date Published: 1/25/2016 Conference: Pan Pacific Symposium
As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.
Through Glass via (TGV), Glass, Panel
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