Pan Pacific Symposium Conference Proceedings

Embedded Camera Module for Automotive Camera System

Authors: Hyunho Kim and Jongtae Lee, Se-meyung Hwang, and Sangsuk Cha
Company: Center for Integrated Smart Sensors KAIST and Simmtech Co., Ltd.
Date Published: 1/25/2016   Conference: Pan Pacific Symposium

Abstract: This paper presents embedded camera module using embedded assembly technology to meet the industry’s growing needs for rearview cameras, front-view cameras, surround-view cameras, multi-lens array cameras, stereoscopic and most other automotive camera assembly and test requirements. Embedded camera module is configured by device embedded substrate with embedding passive components using embedding process, glass lens with horizontal view more than 100 degree, blue filter with image tuning, holder with heat dissipation structure design, and low power CMOS image sensor with full HD. The fabricated embedded camera module provides many features required to deliver a high-quality product to the automotive market. Due to their applications being directly linked to the safety of consumers, quality and reliability in the manufacturing of automotive cameras is critical and we evaluated performance and thermal characteristics of embedded camera module with heat dissipation package for improving high thermal reliability for automotive camera module.

Key Words: 

Embedded Camera Module, Device Embedded Substrate, CMOS Image Sensor, Heat Dissipation Package, Automotive Camera System

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