Pan Pacific Symposium Conference Proceedings


High-Density Assembly and Root Cause Analyses

Authors: Jonas Sjoberg, Chris Nash, David Sbiroli and Wisdom Qu
Company: Indium Corporation
Date Published: 1/25/2016   Conference: Pan Pacific Symposium


Abstract: Implementing high-density assembly in all electronic products requires many considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities. If this is not fully understood, failure is the most probable outcome. This paper will discuss selection of the correct solder paste based on the end product and the need to conduct proper root cause analyses before making any material or process changes.

Key Words: 

High-Density Assembly, Solder Paste Selection, Root Cause Analyses, PCB Design, Assembly Process



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