Surface Mount International Conference Proceedings


DEVELOPMENT OF MF-BGA (MOUNTING FRAME BGA)

Author: Noriaki Taketani
Company: Hitachi Cable
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Development of CSPs has been facilitated as the recent achievement of down sizing in electronic devices such as portable personal computers and phones strongly requires the down sizing in LSI packages1). TCP (Tape Carrier Package) which consists of polyimide based flexible circuit board is considered breakthrough technology in CSP field due to its feasibility of very fine pitch circuit. This paper describes the manufacturing processes and the characteristics of MF-BGA (Mounting Frame Ball Grid Array) which enables conventional QFP (Quad Flat Package) lines to manufacture CSPs of TCP type.



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