Multipurpose Lead-Free Reliability Prediction ModelAuthors: Olli Salmela, D.Sc.(E.E.), Jussi Putaala, D.Sc. (E.E.), Olli Nousiainen, D.Sc., Antti Uusimäki, D.Sc., Jussi Särkkä, D.Sc. and Markku Tammenmaa, D.Sc.
Company: Nokia and University of Oulu
Date Published: 1/25/2016 Conference: Pan Pacific Symposium
Since those days, the model has gained quite some popularity and both its validity and accuracy have been proven. Moreover, materials and interconnection types that the model is valid for have significantly been extended. Now, for example lead-free solder castellations, collapsible and non-collapsible lead-free BGA solder joints can be accounted for in the model. In this paper, a new use case to the list is introduced: attaching power devices to their heat sink. A new interpretation of distance to neutral point in case of one single solder joint is needed for that. The correction term has also developed since Engelmaier’s days from constant value through logarithmic model to second-order polynomial shape. This paper summarizes this development in a user-friendly way that makes it easy for the practitioner to choose the right one for his specific purpose. Also, the expected accuracy of each approach is estimated. In addition to Engelmaier’s model, where absolute lifetime predictions are looked for, a parallel relative, acceleration-factor-based reliability prediction model using Norris-Landzberg model is provided.
Solder, Lead-Free, Reliability, Prediction
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