Electronic Components & Materials CompatibilityAuthor: Eddie Hofer
Company: Rockwell Collins
Date Published: 11/18/2014 Conference: Symposium
The scope of this presentation would be to highlight the work being done within IPC to help develop guidance on cleaning compatibility issues, develop test methodologies to troubleshoot issues in manufacturing and to ultimately provide a better solution than the current Mil-Std-202 Method 215 which is widely utilized today. Mil-Std-202 and 215 test methods do not accurately represent modern cleaning chemistries and the cleaning equipment advancements that are currently used within electronic assembly manufacturing processes.
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