Surface Mount International Conference Proceedings


COMPATIBILITY OF CSPs IN SMT ASSEMBLY (PART C OF CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS)

Author: I. Sterian
Company: Celestica Inc.
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: As an active participant in the JPL CSP Consortium, Celestica Inc. has been involved in the CSP test vehicle design review and test vehicle assembly. As in kind contribution to the consortium, Celestica’s Customer Oriented Rapid Engineering Lab was used for assembly and inspection of the CSP test vehicle. With broad experience in electronics assembly, the Celestica team has set goals to integrate CSPs into main stream SMT assembly. The assembly process flow, as well as a thorough description of the test vehicle assembly is reported in this paper. Some of the key process parameters were optimized, and future work has been scheduled based on our initial results.



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