Surface Mount International Conference Proceedings


REWORKING AND REBALLING BGAS

Author: Steve Stach
Company: Process Sciences Inc.
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Conventional ball grid array (BGA) rework techniques address removing and replacing a defective BGA with a new device, leaving the removed device in a scrap pile. This is often unnecessary and expensive as the most common reasons for BGA failures are solder shorts and opens. This paper will address the rework and repair techniques, which are available to re-ball or otherwise repair the original BGA. This would be of great importance if the original BGA was either expensive ($50 or greater) or if the device was unavailable (application specific IC’s).



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