Medical Electronics Symposium Conference Proceedings

Functionalization of Printed Circuit Boards Through Integration of Electronic Modules

Authors: Marco Gavignin, Ph.D.
Company: AT&S
Date Published: 9/16/2015   Conference: Medical Electronics Symposium

Abstract: PowerPoint Presentation Only

Microelectronics is an ever-growing research field enabling a wide variety of medical applications, such as hearing aids, pacemakers, neurostimulators and drug delivery systems just to name a few. One of the main technology trends in printed circuit boards (PCBs) for medical applications is the electronics miniaturization, mainly supported by high density interconnect (HDI) and rigid-flex technologies. However, PCB advanced production processes enable high mechanical and electrical integration beyond the miniaturization of copper tracks interconnections. In this work, 2.5D and ECP (embedded component packaging) will be presented as novel technology platforms (TP) for device miniaturization and outstanding component integration, respectively. Furthermore, concrete applications in the field of prostesis and wireless sensors supported by AT&S TP will be presented.

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