Medical Electronics Symposium Conference Proceedings


Automation of Flex Substrate Electronics Final Assembly: Mechanized Origami

Authors: John Roos, Drew Elliott
Company: Micro Systems Engineering
Date Published: 9/16/2015   Conference: Medical Electronics Symposium


Abstract: PowerPoint Presentation Only

High packaging density medical electronics design and assembly is enabled by the use of flexible substrates. Repeatable, precise and controlled folding of these assemblies is a critical factor to enable the needed quality and reliability of the circuits. Flexible substrates allow for folding and interleaving SMT component topographies to reduce volume as well as making 3D interconnects between mixed-format components such as batteries, high voltage caps, feedthroughs and mechanical frames. The primary manufacturing challenge is handling the flexible substrate through surface mount assembly and especially final assembly. As evidenced by existing product architectures the final assembly challenge is typically resolved by reverting to manual methods. This paper presents a case study where major elements of the final assembly of defibrillator electronics have been fully automated. Automation has been enabled by early co-development of device-level mechanical architecture, components and manufacturing methods. The automation approach is implemented incrementally in manufacturing to enable product roadmap schedules and minimize investment risk.



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