Medical Electronics Symposium Conference Proceedings


Cost, Size and Energy Efficiency Through 3D Silicon Integration

Author: Guillaume Raimbault
Company: IPDiA
Date Published: 9/16/2015   Conference: Medical Electronics Symposium


Abstract: PowerPoint Presentation Only

Today’s goal is to miniaturize medical implants in order to simplify surgical procedures and to optimize the costs of such treatments. In the meantime, these implantable devices target a longer operating lifetime and have to be smarter, still being as reliable as the previous ones. Consequently the miniaturization and efficiency of energy storage in such implants are becoming key points during the design phase One way to cope with these new requests is to benefit from the latest silicon technologies to design 3D components and assemblies. IPDiA in Caen (France) is the world leader of integration of capacitors and other passive components using the inherent strengths of silicium. IPDiA already designed and is delivering products to the top leaders in medical electronics. These co-operations result in smaller and particularly more reliable integrated electronic devices with an increased performance in stability and power consumption. We will present today’s state-of-the-art of that technology and the projected developments for the coming 4 years. The presentation will focus on the benefits for healthcare as well as the experiences of our client/partners and how it is re-defining design rules of the implantable devices.



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