MAKING SENSE OF CSPS AND BGAS THROUGH TECHNICAL COST MODELINGAuthor: Adam T. Singer
Company: IBIS Associates, Inc.
Date Published: 8/23/1998 Conference: Surface Mount International
Technical Cost Modeling (TCM), an extension of activities based costing, is a robust methodology for examining the relative cost positions of competing packaging technologies. The power of Technical Cost Modeling lies in its ability to compare direct manufacturing costs for numerous packaging options with relative ease. In addition, cost sensitivities can be examined for key cost drivers.
This paper will explain in detail the Technical Cost Modeling methodology, and give examples of recent analysis for several IC packaging technologies, including CSPs, BGAs, and flip chip.
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