Surface Mount International Conference Proceedings


MAKING SENSE OF CSPS AND BGAS THROUGH TECHNICAL COST MODELING

Author: Adam T. Singer
Company: IBIS Associates, Inc.
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: With many IC packaging options in today’s electronics market, it becomes increasingly difficult to discern between all the different packaging technologies. Often new packaging technologies are introduced to the market with announcements of superior performance charateristics. While enhanced performance is crucial to a new packaging technology’s success, wide implementation depends largely on it having a lower cost position relative to the incumbent packaging options.

Technical Cost Modeling (TCM), an extension of activities based costing, is a robust methodology for examining the relative cost positions of competing packaging technologies. The power of Technical Cost Modeling lies in its ability to compare direct manufacturing costs for numerous packaging options with relative ease. In addition, cost sensitivities can be examined for key cost drivers.

This paper will explain in detail the Technical Cost Modeling methodology, and give examples of recent analysis for several IC packaging technologies, including CSPs, BGAs, and flip chip.



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