SMTA International Conference Proceedings

The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of ENEPIG Deposits

Authors: Tsuyoshi Maeda, Shinsuke Wada, Katsuhisa Tanabe, Yukinori Oda, Shigeo Hashimoto, Don Gudeczauskas and George Milad
Company: C. Uyemura & Corporation Co., Ltd. and UIC Technical Center
Date Published: 9/27/2015   Conference: SMTA International

Abstract: Regarding Electro-less Ni/Pd/Au (ENEPIG) deposits, we focused on the type of Pd deposit, especially different P contents between 0 and 6% in the Pd deposit and we compared each characteristic. As a result, we found that Pd deposits with each P content had a best range of Pd thickness for solder joint reliability (SJR). On the other hand, we found that ENEPIG deposits with Pure-Pd which didn’t include P contents had slightly better wire bonding reliability (WBR) than ENEPIG deposits with Pd-P when the Pd deposit was thicker.

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