SMTA International Conference Proceedings

Advanced Closed Loop Process Control for Selective Soldering

Author: Bob Klenke
Company: ITM Consulting
Date Published: 9/27/2015   Conference: SMTA International

Abstract: Selective soldering is a commonly used method of soldering through-hole (TH) components into a mixed-technology printed circuit board assembly (PCBA) that would otherwise either be hand soldered or soldered with a wave soldering machine using an aperture pallet to shield SMT components from the molten solder. Selective soldering is being increasing used when a number of TH components such as connectors, etc. need to be soldered into high quality medical, automotive or aerospace board assemblies.

In order to prevent potential damage to adjacent SMT components mounted on complex PCBAs, the overall accuracy of the selective soldering process must be precise. This requires the development of advanced selective soldering process control technologies to ensure the selective soldering process is carried out within a welldefined process control protocol.

This paper addresses several advanced closed loop process control initiatives for selective soldering including: board alignment, flux deposition, flux verification, thermal datalogging, board warpage compensation, solder nozzle technology, and graphics-based programming.

Key Words: 

selective soldering, fiducial alignment, warp compensation, flux verification

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