Advanced Closed Loop Process Control for Selective SolderingAuthor: Bob Klenke
Company: ITM Consulting
Date Published: 9/27/2015 Conference: SMTA International
In order to prevent potential damage to adjacent SMT components mounted on complex PCBAs, the overall accuracy of the selective soldering process must be precise. This requires the development of advanced selective soldering process control technologies to ensure the selective soldering process is carried out within a welldefined process control protocol.
This paper addresses several advanced closed loop process control initiatives for selective soldering including: board alignment, flux deposition, flux verification, thermal datalogging, board warpage compensation, solder nozzle technology, and graphics-based programming.
selective soldering, fiducial alignment, warp compensation, flux verification
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