Plasma Based VOC-Free Fluxing for Selective and Wave SolderingAuthors: Andreas Reinhardt, Ph.D. and Sonja Wege, Ph.D.
Company: SEHO Systems GmbH
Date Published: 9/27/2015 Conference: SMTA International
A series of experiments were performed to determine the soldering results for plasma fluxed PCBs. It has been determined that using suitable powders no difference in the results can be determined comparing standard solvent based flux and the plasma technology. Actually, even overaged PCBs could be revived and showed faultless soldering results. The evaluation criteria has been the hole fill of plated-through hole solder joints according to IPC-A-610.
The process can be easily implemented in existing manufacturing as a drop-in solution for both wave soldering and selective soldering. SIR tests have demonstrated that residues after the soldering process have no critical properties. Using this technology, the material logistics can be simplified by eliminating the handling of hazardous materials. Due to reduced creep and reduced residues also the soldering results and need for maintenance of the machines can be improved.
flux, powder, plasma, soldering, adipic acid
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