Surface Mount International Conference Proceedings


Authors: E.J. Simeus,
Company: California Institute of Tech
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: The JPL-led Microtype BGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This paper will present specifically the experience of four consortium team members on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current package isothermal aging and thermal cycling test results. In addition, it includes the experience of a team member who joined the consortium with a test vehicle unique to their needs. The paper is structured so as to provide both an overview and independent articles provided by the team members.

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