SMTA International Conference Proceedings

The Future of Nanotechnology in Electronics Assembly and the Investigation of Nano-Coating Materials for Water Resistant Applications

Authors: Jennifer Nguyen, David Geiger, Anwar Mohammed and Murad Kurwa
Company: Flextronics International
Date Published: 9/27/2015   Conference: SMTA International

Abstract: Nanotechnology has the potential to have a positive impact on electronics assembly. Nanotechnology works with nanoscale particles which has dimension typically from 1 to 100 nanometers. When the particle size of an element reaches nanoscale, its properties such as melting point, fluorescence, electrical conductivity, magnetic permeability, and chemical reactivity change as a function of the size of the particle. At the nanoscale, matter begins to demonstrate entirely new and unique properties. It can become stronger, have a lower melting point, conduct heat better, or have extraordinary electrical properties.

In this paper, we’ll present the trends and opportunities for nanotechnology and nanomaterials such as nano-solder, nano- coating in electronics manufacturing. This paper will discuss the advantages and challenges of using the nanotechnology and nano-materials from an EMS perspective.

Then, a case study will be presented on the investigation and evaluation of different nano-coating materials for water resistant applications. The performance of nano-coating materials for water resistant application will be analyzed and compared to parylene coating.

Key Words: 

nanotechnology, nano-material, nano coatings, nano-solder water resistant, coating, splash proof, nano, parylene, conformal

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