Cleanliness Makes a Difference When Miniaturization Kicks InAuthors: Mike Bixenman, DBA, David Lober, Mark McMeen and Jason Tynes
Company: KYZEN Corporation and STI Electronics, Inc.
Date Published: 9/27/2015 Conference: SMTA International
Companies who require devices to meet long term reliability need an improved industry specification that allows for an accurate risk assessment. The problem is that the risk assessment is a multi-variable issue influenced by flux type, activation temperature, component type and placement; the type and criticality of the circuit in which the component is in, wash characteristics, solder paste volume, PCB cleanliness and component contamination. Current measures of “clean” do not indicate if the product is clean in a critical area, which is what we hope to do.
This paper will report ongoing research to study these multivariant issues using a new test vehicle with sensors placed under and near bottom terminations. The test vehicles are designed to track impedance where it matters most. The goal of this research is to develop an improved method for studying multi-variables that may impact circuit reliability. Data findings, inferences from the data findings, and recommendations will be documented and presented.
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