A Different Perspective on Solder Paste Printing: Perfecting the Print Process with Practical SolutionsAuthors: Michael J. Cieslinski and Brent A. Fischthal
Company: Panasonic Factory Solutions Company of America
Date Published: 9/27/2015 Conference: SMTA International
Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.
Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen-printing.
In the end, both paths aim to maximize profitability. As such, understanding how manufacturers can successfully integrate low-cost materials will help ensure high-quality production, reduce costs, and maximize profitability in a high-volume printed circuit board assembly environment.
Solder Paste Printing, Low Cost Materials, Masks, Paper, Stencils, Stable, Panasonic
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