Electronic Assembly Pitting / Crevice Corrosion ResearchAuthors: Mike Bixenman, DBA, Wallace Ables, Richard Kraszewski, Chin Siang Kelvin Tan, Julie Silk, Keith Howell, Takatoshi Nishimura, Jim Hartzell, Karl Sauter, and Robert Smith
Company: Kyzen Corporation, Dell Computer, Plexus Corporation, Keysight Technologies, Nihon Superior, Enthone, Oracle, and HDPug
Date Published: 9/27/2015 Conference: SMTA International
Pitting / crevice corrosion is different than the well-studied electrochemical migration dendritic corrosion events. Test vehicles used to simulate pitting / crevice corrosion failure have been designed. Experiments to test the research hypothesis that pitting / crevice corrosion can occur on printed circuit boards soldered with no-clean wave fluxes are in progress and results to date will be documented in this research paper. This paper covers the correlation phase by comparing and contrasting existing IPC Test Methods to a newly designed Pitting / Crevice Corrosion test method. A description of the mechanism, data findings, inferences from the data findings and follow on research plans are reported in this paper.
electrochemical migration, crevice corrosion, pitting corrosion
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