SMTA International Conference Proceedings


DESIGN, ANALYSIS, AND MEASUREMENT OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE

Author: John Lau
Company: Express Packaging Systems
Date Published: 9/12/1999   Conference: SMTA International


Abstract: The design, analysis, and measurement of a thermal and electrical enhanced cavity-down plastic ball grid array (PBGA) package are presented in this study. Because of the split via connection (SVC) design, the package consists of a very-thin single core of organic material and two-metal layers of copper and is manufactured with the conventional printed circuit board (PCB) process at very low cost. Further more, the heat spreader is made with bottom surface having saw-teeth to contact the ground planes disposed on the backside of the substrate. Improvements in electrical and thermal performance are achieved. Parasitic parameters of the package are extracted from time domain reflectometer (TDR) measurements. The thermal performances of the packages are studied by both 3-D finite element analysis and wind-tunnel measurements. The results are compared with other well-known packages.



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