SMTA International Conference Proceedings


Key Technical Challenges And Process Improvements For An Electronics Manufacturing Service Provider

Authors: Robert Farrell, Bruce Tostevin, Rick Wyman, Paymon Adl-zarabi
Company: Benchmark Electronics, Inc.
Date Published: 9/27/2015   Conference: SMTA International


Abstract: This paper summarizes key technical challenges and process improvements for an Electronics Manufacturing Service (EMS) provider. The topics encompass SnPb assembly, hybrid assembly (Pb-free Ball Grid Array on a SnPb assembly), and Pb-free assembly for IPC Class 2 and 3 assemblies using no clean and water soluble chemistries. Assemblies include large, thick, heavy boards that are thermally disparate.



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