SMTA International Conference Proceedings

High Efficient Heat Dissipation on Printed Circuit Boards

Author: Markus Wille
Company: Schoeller-Electronics GmbH
Date Published: 9/27/2015   Conference: SMTA International

Abstract: This paper describes various techniques for dissipating heat from heat generating electrical components on printed circuit boards (PCBs). Small copper coins that are matching the shape of the electrical components are located underneath the component and are integrated into the PCB construction. The heat from the component will be dissipated by the copper coin to a heat sink or cold plate. The thermal conductivity of such kind of copper coin is about 10 times higher than usually achieved with so called thermal via arrays. Several different methods of integrating copper coins into the construction of PCBs have been developed and will be discussed.

New developments such as the "Chip-on-Coin" technique are providing solutions for highly miniaturised electronic circuits and micropackaging. The integration of copper coins into PCBs is suitable for all common substrates including RF and microwave substrates as well as for conventional PCB substrates.

Key Words: 

PCB, heat dissipation, thermal via, copper coin, press-fit, bare die attach

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