High Efficient Heat Dissipation on Printed Circuit BoardsAuthor: Markus Wille
Company: Schoeller-Electronics GmbH
Date Published: 9/27/2015 Conference: SMTA International
New developments such as the "Chip-on-Coin" technique are providing solutions for highly miniaturised electronic circuits and micropackaging. The integration of copper coins into PCBs is suitable for all common substrates including RF and microwave substrates as well as for conventional PCB substrates.
PCB, heat dissipation, thermal via, copper coin, press-fit, bare die attach
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