FLIP CHIP UNDERFILL CHARACTERIZATION METHODS: DEVELOPING A TEST METHODOLOGY FOR SUCCESS IN THE HARSH AUTOMOTIVE ENVIRONMENT
Author: James M. Rosson Company: Delphi Delco Electronics Sys Date Published: 8/23/1998
Surface Mount International
Abstract: Understanding the complex relationships surrounding flip chip underfill materials is critical for successful implementation of laminate-based flip-chip-on-board technology. Delphi Delco Electronics Systems has, over a four year period, evaluated and characterized more than 60 underfill materials that are applicable to automotive electronics applications. A series of screening experiments were developed and utilized to select appropriate underfill materials for targeted flip chip applications. This paper outlines materials test methodologies that may be utilized as common practices for the flip chip assembly community and the materials supply infrastructure. These test methods are robust and quite useful in the development of flip chip underfill materials and associated assembly processes.