Sulfur Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich EnvironmentsAuthors: Matthew D. Weeks, Ph.D., David J. Zueck
Company: Western Digital Technologies, Inc.
Date Published: 9/27/2015 Conference: SMTA International
Different surface finishes were found to exhibit different forms of corrosion, which result in fundamentally different corrosion outcomes. Corrosion of ENIG proceeded by stress-corrosion cracking (SCC) of the nickel phosphorous plating, which was followed by pitting/crevice corrosion of the underlying copper pad in the vicinity of compromised NiP regions. ImAg finishes corroded by a combination of crevice and galvanic mechanisms, primarily in solder mask defined (SMD) pad regions and those directly underneath compromised ImAg plating. Corrosion of PCB finished with organic solderability preservative (OSP) proceeded by way of a uniform/pitting corrosion mechanism.
Creep corrosion, printed circuit board, surface finish, copper sulfide
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.