A Packaging Physics of Failure Based Testing Methodology for Semiconductor IC Part Reliability Assessment
Authors: Jingsong Xie, Ming Sun, and Fei Xie Company: RelEng Technologies, Inc. and Engent Inc. Date Published: 9/27/2015
Abstract: Functional testing is repeatedly performed at several IC part manufacturing stages, from post wafer fabrication to packaging, it is very important to understand its inefficiencies and weaknesses, such as, time zero static electrical functional testing without finding or predicting potential lifetime and operating stress associated quality and reliability issue. Reducing or eliminating these inefficiencies and weaknesses enables an IC part manufacturer to drive down the risk of delivering a bad part or potential a bad part in the lifetime to customers and associated cost of the final product. It is also important to understand the reason and physics of failure before finalize the testing and quality/reliability assurance flow. In this paper, a risk assessment testing methodology built in the fundamentals of packaging physics of failure is discussed in terms of reliability tests and package assembly process flows, associated with package structure, bill of materials (BOM) and failure mode effects analysis (FMEA).
physics of failure, IC testing, reliability assessment