The Quantitative Assessment of Mixed BGA Joint with the Elimination of Low-Melting Point Alloy Re-Melting ProcessAuthors: Hongqin Wang, Guanghui He and Daojun Luo
Company: China Electronic Product Reliability and Environmental Testing Institute
Date Published: 9/27/2015 Conference: SMTA International
Serious crack defects of the complete mixed solder joints happened after the waving soldering process. Then a series of the reflow soldering profiles and tests were developed to solve the crack phenomenon and the mechanism of the crack phenomenon was illustrated with the quantitative assessment of mixed solder joints.
The reliability of mixed solder joints after optimazaiton was studied with an accelerated thermal cycling(ATC) test in the temperature range of -40C to 125C for a maximum of 3000 cycles in accordance with IPC 9701A standard.
backward process, lead-free PBGA, mixed solder alloy, reliability
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