Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA ApplicationsAuthors: Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D., Kelley Hodge, and Qing Ji, Ph.D.
Company: Engent, Inc. and H. B. Fuller
Date Published: 9/27/2015 Conference: SMTA International
This paper presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkability. Four reworkable edge bond materials (commercially available) were studied. Test vehicles included 12mm BGAs with plans to expand the study to include ceramic BGAs and large area BGAs. Process development was also conducted on the edge bond process to determine optimum process conditions. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. The reliability testing protocol used included board level thermal cycling (-40 to 125 °C) and random vibration testing (3 G, 10 – 1000 Hz).
Reworkable, Edge Bond, Adhesive, BGA, Large Area BGA
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