Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High TemperatureAuthor: Emmanuelle Guéné
Date Published: 9/27/2015 Conference: SMTA International
While remaining a relatively small market, the demand for alloys with low melting temperature, to allow soldering of temperature sensitive components or substrates, has grown significantly in the last few years.
On the other hand, alloys with a significantly higher melting temperature than SAC305 are required in the first soldering process of the daughter boards, to avoid the reflow during the assembly of the main board.
After outlining the state of the art, the paper will describe the characteristics of the alloys with the expected properties, the development of suitable flux media according to their specificities, the solder pastes performance and the reliability of their solder joints.
low temperature, high temperature, bismuth-tinsilver, tin-antimony, wettability
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