SMTA International Conference Proceedings

Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature

Author: Emmanuelle Guéné
Company: Inventec
Date Published: 9/27/2015   Conference: SMTA International

Abstract: The Tin-silver copper alloy SAC305 is the most commonly used in lead-free electronic assembly, especially in SMT process. Due to the evolution and the diversification of assembly technologies, needs for suitable lead-free alternative alloys have appeared.

While remaining a relatively small market, the demand for alloys with low melting temperature, to allow soldering of temperature sensitive components or substrates, has grown significantly in the last few years.

On the other hand, alloys with a significantly higher melting temperature than SAC305 are required in the first soldering process of the daughter boards, to avoid the reflow during the assembly of the main board.

After outlining the state of the art, the paper will describe the characteristics of the alloys with the expected properties, the development of suitable flux media according to their specificities, the solder pastes performance and the reliability of their solder joints.

Key Words: 

low temperature, high temperature, bismuth-tinsilver, tin-antimony, wettability

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