Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic PackagesAuthors: Minerva M. Cruz and Russell T. Winslow
Company: Six Sigma
Date Published: 9/27/2015 Conference: SMTA International
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized. It may also help explain why pure gold finishes fail solderability testing after steam-conditioning -- a test they should otherwise pass with ease.
Nickel Hydroxide, Solderability, HTCC, Corrosion
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