SMTA International Conference Proceedings

Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages

Authors: Minerva M. Cruz and Russell T. Winslow
Company: Six Sigma
Date Published: 9/27/2015   Conference: SMTA International

Seika Machinery, Inc.

Abstract: This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture. Using a “farming method”, enough residue was created to facilitate a thorough analysis. Tests using SEM-EDS, Fourier Transform Infrared Spectroscopy, Raman Spectroscopy, and X-ray Diffraction have identified these residues as primarily ß-Ni(OH)2 and a-Ni(OH)2. Traces of tungsten oxide and a silicate compound were also detected.

The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized. It may also help explain why pure gold finishes fail solderability testing after steam-conditioning -- a test they should otherwise pass with ease.

Key Words: 

Nickel Hydroxide, Solderability, HTCC, Corrosion

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