SMTA International Conference Proceedings


Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders

Authors: Thomas Sanders, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael Bozack, Ph.D., Wayne Johnson, Ph.D., and Jeff Suhling, Ph.D.
Company: Auburn University and Tennessee Tech University
Date Published: 9/27/2015   Conference: SMTA International


Abstract: This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.

Isothermal storage at high temperature was used to accelerate the aging of the assemblies. Aging Temperatures are 25oC, 50oC, and 75oC. Select data from aging times of 0-Months (No Aging, baseline), 6-Months, and 12-Months will be presented.

The assemblies were subjected thermal cycles of -40°C to +125°C on a 120 minute thermal profile. The test was subject to JEDEC JESD22-A104-B standard high and low temperature test in a single-zone environmental chamber to assess the solder joint performance.

The principal test components are 5 mm, 6mm, 13mm, 15mm, 17mm, 31mm, 35mm and 45 mm ball grid array (BGA) packages with solder ball pitch varying from 0.4 mm to 1.27 mm. Most of the BGA packages are plastic over-molded, while the 31mm and 45mm packages are Super-BGAs (SBGAs). Several surface mount resistors (SMRs) are also considered in order to understand the effect of solder paste composition on paste-only packages.

The primary solder for package attachment in this experiment is standard SAC305. Two solders designed for high-temperature reliability are also considered.

Key Words: 

BGA, PCB, Reliability, Solder, lead free, HALT



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