A Selected Comparison from ATC Test: Industry Progress from 2005 to Present DayAuthors: John McMahon, Russell Brush, and Brian Standing
Company: Celestica Inc.
Date Published: 9/27/2015 Conference: SMTA International
Package technology has progressed significantly as have process materials and chemistry. There are specific component categories where comparisons are easier to make. Ceramic ball grid array (CBGA) components are one such case.
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014 and ranging from 32.5 x 32.5 mm and 937 IO to 55 x 55 mm and 2892 IO. Assembly yields and processes are compared as well as ATC test results. Weibull distributions and parameters are provided along with selected destructive failure analysis and discussion of the mechanisms.
Accelerated thermal cycling, Reliability testing, Ceramic components, Weibull analysis
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