SMTA International Conference Proceedings


A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day

Authors: John McMahon, Russell Brush, and Brian Standing
Company: Celestica Inc.
Date Published: 9/27/2015   Conference: SMTA International


Abstract: Accelerated thermal cycling (ATC) is the accepted test methodology for characterizing the expected service life of electronic components. When combined with vibration, shock and bend testing it can provide a reasonable confidence that the material under test will perform robustly in field service. Since the year 2005 the team has conducted ATC testing on over 500 lots of components. Looking back at some of the early work and how those assembly lots would compare to current industry expectations provides some real insight to the progress made by the industry.

Package technology has progressed significantly as have process materials and chemistry. There are specific component categories where comparisons are easier to make. Ceramic ball grid array (CBGA) components are one such case.

This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014 and ranging from 32.5 x 32.5 mm and 937 IO to 55 x 55 mm and 2892 IO. Assembly yields and processes are compared as well as ATC test results. Weibull distributions and parameters are provided along with selected destructive failure analysis and discussion of the mechanisms.

Key Words: 

Accelerated thermal cycling, Reliability testing, Ceramic components, Weibull analysis



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