Symposium Conference Proceedings


Inspection Strategies for More Accurate, Faster and Smarter Inspection

Authors: Dr. Subodh Kulkarni, Sean Langbridge, Dick Johnson
Company: CyberOptics Corporation
Date Published: 4/8/2014   Conference: Symposium


Abstract: SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. SPI systems measure the height and volume of the solder paste before the components are placed and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to SPI measurement is the accuracy of volume measurement as it has a direct correlation with solder paste defects.



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