Surface Mount International Conference Proceedings


PROCESS LIMIT TESTING ON FLUXES USED FOR FLIP CHIP SOLDERING

Author: Paul Novak
Company: Delphi Delco Electronics Sys.
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Soldering fluxes used for laminate-based flip chip-on-board (FCOB) technology must serve two primary functions. First, the flux must hold the flip chips securely in place prior to solder reflow. Second, the flux must promote solder wetting to the metalization on the substrate. In the process of choosing a flux for automotive electronics applications, it was determined that the selected flux could fulfill these two primary functions. However, another set of tests was needed to determine how the flux would interact with the manufacturing system. The goal was to determine the limits (sometimes called boundaries or windows) for those manufacturing processes that involve, or are affected by, the selected flip chip flux. Since the selected flux lent itself well to being applied by either screen printing or dipping, process limits for both application methods were determined. The tests were designed so the results could also be used to specify time limits between processes, determine tooling designs, and to specify inputs to a factory information system. Keywords: Flip Chip, Flip Chip-On-Board, FCOB, Direct Chip Attach, DCA, Flux, Screen Printing, Dip Fluxing



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