Bottom Termination Component Design Considerations to Improve CleaningAuthors: Dr. Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach
Company: Kyzen Corporation, Plexus Corporation, Raytheon, and Austin American Technology
Date Published: 4/8/2014 Conference: Symposium
From a cleaning perspective, many designers have poor insight into factors that assure a cleanable design. Variables such as solder paste, reflow conditions, component placement, component clearance (standoff), cleaning agent and cleaning equipment are important factors. Collaboration between process engineers, assembly designers, solder materials, cleaning agent and cleaning equipment experts can improve integration of the BTC design and assembly. Circuit board design plays an important role when cleaning is required. The purpose of this research is to study design considerations of BTC components in an effort to reduce flux residue under the bottom termination and improve cleaning effects.
QFN, MLF, LPCC, QLP, HVQFN, LCC, Electronic Assembly Cleaning, Flux Residue, Electrochemical Migration
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