Symposium Conference Proceedings


Ultra Miniaturized 01005 Passives Assembly

Authors: Ng Chin Fei, Ng Shirley, Ooi HockWooi, Lim SiewFong
Company: Motorola Solutions, Inc.
Date Published: 4/8/2014   Conference: Symposium


Abstract: Due to the increased need for smaller and multi-function electronic devices, development teams have been forced to consider using miniaturized passive components and micro fine pitch BGA to push for size. This technology would definitely allow products to utilize available real estate more effectively and maintain a competitive advantage. Up to date, the 01005 package has not yet achieved anything resembling widespread adoption in the overall electronics industry and this has been confirmed in the benchmarking analysis of latest smartphones.

Solder paste printing is one of the critical steps in surface mount manufacturing affecting directly the yield and quality of assembly. In this study, the printing quality was optimized considering printing parameters, stencil thickness, stencil aperture, aperture shape, solder paste type and nanocoating technology using Design of Experiments (DOE). The statistical significance of parameters was studied and the correlations were plotted via 6 sigma black belt methodology.

It has been a constant concern in maintaining high yields in the assembly process of 01005 passives due to its relatively small size compared to 0201 and 0402. In light of this need, component placement Cpk and reflow soldering defect were being studied using AOI and AXI to ensure the quality and reliability of the 01005 passives assembly.

Key Words: 

01005 Passives, Optimization, Taguchi method, DOE



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