Ultra Miniaturized 01005 Passives AssemblyAuthors: Ng Chin Fei, Ng Shirley, Ooi HockWooi, Lim SiewFong
Company: Motorola Solutions, Inc.
Date Published: 4/8/2014 Conference: Symposium
Solder paste printing is one of the critical steps in surface mount manufacturing affecting directly the yield and quality of assembly. In this study, the printing quality was optimized considering printing parameters, stencil thickness, stencil aperture, aperture shape, solder paste type and nanocoating technology using Design of Experiments (DOE). The statistical significance of parameters was studied and the correlations were plotted via 6 sigma black belt methodology.
It has been a constant concern in maintaining high yields in the assembly process of 01005 passives due to its relatively small size compared to 0201 and 0402. In light of this need, component placement Cpk and reflow soldering defect were being studied using AOI and AXI to ensure the quality and reliability of the 01005 passives assembly.
01005 Passives, Optimization, Taguchi method, DOE
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