Surface Mount International Conference Proceedings


FLIP CHIP ON LARGE AREA PANEL LAMINATES WITH RELIABILITY ASSESSMENT RESULTS

Author: P. Nerio
Company: MicroModule Systems
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: Substrate processing, test vehicle development, characterization and preliminary stress test results will be A flip chip on laminate packaging concept utilizing low cost discussed. large area laminate panel processing is in development. By processing thin films on large area laminates, increased I/O and line densities are achievable when compared to standard PCB design rules.



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