SMTA International Conference Proceedings


Author: Richard R. Lathrop Jr.
Company: Heraeus
Date Published: 9/12/1999   Conference: SMTA International

Abstract: With the increasing speed of today’s chipshooters the bottleneck can be shifting to the solder paste printing and adhesive dispensing operations in the quest for maximum throughput. Speed printing of solder paste can be achieved through careful selection of squeegees or the imaging method as well as solder paste selection. Quantitative printability tests support the various process methods discussed. This decrease of the printing cycle time permits more time for solder print inspection without compromising overall throughput. The current speed limitations of adhesive dispensing technology have renewed interest in adhesive printing for bottom-side component attachment. Adhesive speed printing is discussed using conventional printer and stencil technology. Results are quantified using a novel application of laser triangulation.

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