TSV Barriers Create SMT OpportunitiesAuthors: Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D.
Company: TechLead Corporation
Date Published: 4/8/2014 Conference: Symposium
TSV alternatives such as Package-on-Package (PoP), offer real, albeit less dramatic, system performance improvements with far less supply chain disruption. While more difficult than conventional SMT, high yield, cost-effective PoP processes perform well today both in terms of benefits and manufacturability, enabling SMT organizations to capture market share while TSV R&D consumes resources.
This paper analyzes SMT opportunities created by PoP vs TSV in terms of time-to-market, infrastructure compatibility and capital equipment utilization, throughput, design flexibility, and yield. The authors show that, while TSV continues to hold great promise, PoP represents an attractive strategy for SMT facilities wishing to increase profitability and expand into new markets.
Though Silicon Via, TSV Package-on-Package, PoP, 3D packaging
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