High-Reliability, Pb-Free, Halogen-Free SolderAuthor: Ian J. Wilding & Gavin J. Jackson
Company: Henkel Ltd
Date Published: 4/8/2014 Conference: Symposium
Reliability can also be impacted by no-clean post reflow residues adjacent to solder joints. These may potentially interact with other surface materials causing corrosion issues or lower insulation resistance. With halogen-free electronic assemblies arguably becoming more favourable than halide-free -- even within some automotive manufactures -- solder paste manufactures are now faced with the challenge of formulating halogen-free fluxes which can also demonstrate high reliability. While removing the halogen from a material is not difficult, replacing it with an activator set that can deliver a wide reflow process window whilst retaining or increasing reliability is a significant challenge. The paper also documents the challenges and breakthroughs in developing halogen-free or ‘zero halogen’ solder fluxes which are compatible with the Pb-free alloy specifically designed for higher reliability.
Pb-free solder, High Reliability, Halogen Free, Surface Mount Assembly
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