Symposium Conference Proceedings

The Rheology and Printing Behaviour of Water Soluble Solder Pastes

Authors: Li Tianpeng, Tan Ying Ru Jorcelyn, C. D. Breach and A. Hawkins
Company: Kester
Date Published: 4/8/2014   Conference: Symposium

Abstract: Fluxes and solder pastes can be classed as structured fluids, which are able to support shear stresses and even exhibit yield stresses. The flux properties and interactions between flux and solder particles affect how solder pastes flow when subjected to shear stresses during printing. Solder paste printing performance should therefore depend on the rheology of the flux and paste and in order to understand and improve solder paste printing, the rheological properties of solder paste need to be characterized. However, there is little literature published on solder paste rheology and no clear correlation between solder paste rheology and printing performance.

Key Words: 

water soluble, zero halogen, solderability, rheology

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819